| Xiaopeng Xu | Synopsis, Inc., USA | Multiscale thermal, mechanical and performance analysis for 3DIC with HBM |
| Armen Kteyan | Siemens EDA, Armenia | Full-chip CPI assessment for IC performance and reliability with accurate account of thermal effects |
| Stephane Moreau | CEA, France | How did the “hybrid bonding” technology become reliable? |
| Olivier Thomas | IM2NP, France | Synchrotron X-ray light for understanding Ge-rich Ge-Sb-Te materials used as embedded phase change memories in automotive applications (Online) |
| Kyojin Hwang | Samsung Electronics Co., Ltd., Korea | New embedding capacitor solutions for extremely large FC-BGA package platform |
| Dongwoo Han | SK hynix Inc., Korea | Material Development Trends for Advanced Package |
| Bioh Kim, CEO | Yield Engineering Systems, Inc., Korea | Innovations in Various Process Technologies for Advanced Packaging |
| Eunsuk Jeon, CEO | Laserapps, Korea | Novel singulation of glass substrate for Next generation Advanced semiconductor packaging |
| Joonho You, CEO | nexensor Inc., Korea | The Study of Optical Measurement Technologies for Advanced Packaging and HBM Process |
| Yoonjin Kim, CEO | Teraon Co., Ltd., Korea | TBD |
| Myungho (Mike) Lee, COO | TechL Co., Ltd., Korea | Flexible PCB for mmWave Antenna Application |
| Mujin Kim, CTO | DeepSeers, Korea | Semiconductor Package Inspection: A Comparative Analysis of Machine Vision Techniques for Defect Detection |
| Jeong Won Lee | Nepes, Korea | Chip-let Heterogeneous Integration packaging based on Fan-out RDL interposer technology |
| Roland Rettenmeier, Senior Manager | Evatec AG, Switzerland | TGV for HPC |
| Kuramochi Satoru | Dai Nippon Printing (DNP) Co., Ltd., Japan | RDL on Glass for High Performance Computing Application |
| Hiroki Iwanaga | Toshiba Corporation, Japan | Novel Eu(III) complexes with an asymmetric diphosphine dioxide ligand and their potential uses in micro-LED displays as red phosphors |
| Kyung-Ho Park | Korea Advanced Nano Fab Center, Korea | The Study of the Chemical Mechanical Polishing (CMP) Parameters for Enhanced 3D Cu Hybrid Bonding |
| Seok Hwan Moon | Electronics and Telecommunications Research Institute, Korea | Overcoming the limitations of heat dissipation technology due to high integration and thickness reduction in packaging |
| Hyunkyu Moon | Korea Institute of Machinery and Materials, Korea | 3D Integration of Thin Die on Curved Surfaces for Optical Applications |
| RYU ILL | Seoul National University, Korea | Defect-Driven Plasticity in Microelectronics under thermal cycles |
| Hyejin Jang | Seoul National University, Korea | Thermal Transport Properties of Electronics Packaging at the Nanoscale |
| Sang Won Yoon | Seoul National University, Korea | Considerations for Packaging Solutions for Current Automotive Power Modules |
| Tae-il Kim | Sungkyunkwan University, Korea | Package for Advanced Bioelectronics |
| Jungwan Cho | Sungkyunkwan University, Korea | Thermal property measurements using thermoreflectance techniques for device and packaging applications |
| Sunkook Kim | Sungkyunkwan University, Korea | Flexible Electronics and Sensors |
| Youngsuk Nam | Korea Advanced Institute of Science and Technology (KAIST), Korea | Energy efficient thermal management for AI semiconductors |
| Hyun Park | Dong-A University, Korea | Microstructure and Elongation of Cu foil fabricated through electrodeposition for Batteries |
| Young Min Song | Gwangju Institute of Science and Technology (GIST), Korea | Bioinspired advanced camera modules for application-specific vision systems |
| Seok Kim | Pohang University of Science and Technology (POSTECH), Korea | Transfer Printing for Micro-LED Assembly & Advanced Packaging |
| Tae Yeob Kang | The University of Suwon, Korea | Non-destructive Assessment of Corrosion in Electronic Packages by Processing S-parameters |
| Tae Young Kim | Seoul National University of Science and Technology, Korea | TBD |
| Hyun-Sik Kim | University of Seoul, Korea | Effect of Y2O3-RE2O3(RE= Nd, Sm, Tb, Dy, Tm)-MgO additives on mechanical and thermal properties of silicon carbide ceramics |
| Hyeok Kim | University of Seoul, Korea | Organic Packaging for Encapsulated Power-free Flexible Devices |
| Tatsumi Hiroaki | Osaka University, Japan | Cu Ribbon Soldering on Power Module Substrate using Blue Diode Laser |
| Chuantong Chen | Osaka University, Japan | Development of low temperature Ag-Si composite paste sintering material for high-reliability SiC power modules |
| Zheng Zhang | Osaka University, Japan | Application of Ag cap for fine-pitch Cu pillar interconnection |
| Munho Kim | Nanyang Technological University, Singapore | Wafer bonding and single crystal nanomembrane for flexible electronics |
| Xinge Yu | City University of Hong Kong, Hong Kong | Engineering of packing materials for permeable wearable electronics |
| Yunhyeok Im | Georgia Institute of Technology, USA | TBD |
| Joon Sang Kang | Korea Advanced Institute of Science and Technology (KAIST), Korea | High thermal conductivity material for thermal management in electronics packaging |
| Rock Kim | Siemens EDA, Korea | Innovator3D IC - Siemens EDA's Comprehensive Multiphysics Cockpit for 3D IC design |
| Debbie Claire Sanchez | ERS electronic GmbH, Germany | Yield Improvement in Advanced Packaging through New Photonic Wafer Debonding Technology |
| Takafumi Fukushima | Tohoku University, Japan | 3D-IC and Hybrid Bonding Activity in Tohoku CHIPS |
| Takayuki Miyoshi | Toray Engineering Co., Ltd., Japan | Demonstration of Flux-less Bonding with Simplified Equipment Configuration |
| Taku Hanna | Ulvac Inc., Japan | Polymer Fine via Formation based upon Plasma Etching Technology for 3D Chiplet Integration |
| Satoru Kuramochi | Dai Nippon Printing Co., Ltd., Japan | Large Scale Glass substrate for High Performance Computing Application |
