| Nov 5th, 2024 (Tue) | ||||||
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| 15:30-18:00 | Registration (Lobby, 2F) | |||||
| Nov 6th, 2024 (Wed) | ||||||
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| Room | Grand Ballroom A+B (400) | Capri (120) | Sicily (100) | Sydney (70) | Venice (32) | Miami (32) |
| Topic | Advanced Packaging I | Defect Inspection and Metrology | MEMS/NEMS, Sensors, and Display Packaging Technology | Automotive and Power Electronic Packaging | Materials for Interconnects and Packaging I | Young Scientist I |
| Session Chair | Mhin Sungwook | Park Jiyong | Kang Sumin | Kim Dongjin | Ko Yong-Ho | Park Ah-Young |
| 10:30-10:55 | I1-01 Kim Bioh, Yield Engineering Systems, Inc., Korea Innovations in Various Process Technologies for Advanced Packaging |
I1-03 Ryu Ill, Seoul National University, Korea Defect-Driven Plasticity in Microelectronics under Thermal Cycles |
I1-06 Kang Sumin, Seoul National University of Science and Technology, Korea Advanced Transfer Technologies of Ultrathin Films for Flexible Electronics |
I1-08 Kim Yoonjin, Teraon Co., Ltd., Korea Advanced Non-pressure Die Attach Paste of High Thermal Conductivity and Low Modulus for Power Semiconductor Packages |
I1-12 Thomas Olivier, IM2NP, France Synchrotron X-ray Light for Understanding Ge-rich Ge-Sb-Te Materials Used as Embedded Phase Change Memories in Automotive Applications (Online) |
O1-07 Kim Dong Jun, Korea Advanced Institute of Science and Technology (KAIST), Korea Study on the Intrinsic Thermo-mechanical Properties of TEOS-SiO₂ Thin Films by Thickness through Etching of Naturally Formed Copper Oxide |
| 10:55-11:20 | I1-02 Moon Hyunkyu, Korea Institute of Machinery and Materials (KIMM), Korea 3D Integration of Thin Die on Curved Surfaces for Optical Applications |
I1-04 You Joonho, nexensor Inc., Korea The Study of Optical Measurement Technologies for Advanced Packaging and HBM Process |
I1-07 Kim Seok, Pohang University of Science and Technology (POSTECH), Korea Transfer Printing for Micro-LED Assembly & Advanced Packaging |
I1-09 Yoon Sang Won, Seoul National University, Korea Considerations for Packaging Solutions for Current Automotive Power Modules |
I1-13 Han Dongwoo, SK hynix Inc., Korea Material Development Trends for Advanced Packaging |
O1-08 Lee Gyeongmin, Hansung University, Korea Automatic ROI Recommender for Saw Singulation: Seamless Adaptation for Various Semiconductor Device |
| 11:20-11:45 | O1-01 Moon Seunghyun, Hanwha NxMD Co., Ltd., Korea Irregular Shape SIP Package Manufacturing Process |
I1-05 Kim Mujin, DeepSeers, Korea Semiconductor Package Inspection: A Comparative Analysis of Machine Vision Techniques for Defect Detection |
O1-04 Shin Jungho, Electronics and Telecommunications Research Institute (ETRI), Korea Simultaneous Transfer and Bonding (SITRAB) Technology for Integrating Micro-LEDs onto Display Backplanes |
I1-10 Chen Chuantong, Osaka University, Japan Development of Low Temperature Ag-Si Composite Paste Sintering Material for High-reliability SiC Power Modules (Online) |
I1-14 Kang Sung-Gyu, Gyeongsang National University, Korea Strain Rate and Temperature-Dependent Micromechanical Properties of Copper Micropillars Fabricated by Localized Electrodeposition |
O1-09 Lee Geunil, Sungkyunkwan University, Korea Digital Signal-based Method for Failure Diagnosis of Interconnects under Use Condition |
| 11:45-12:10 | O1-02 Na Youngeun, Hana Micron, Korea Optimizing Power Integrity in 2.xD Packaging for High-Performance Computing |
O1-03 Oh Seung Jin, Korea Institute of Machinery and Materials (KIMM), Korea Mechanical Testing for Advanced Semiconductor Process and Equipment |
O1-05 Paek Mun Cheol, Y-TECH Co., Ltd., Korea Implementation of a Low Temperature Co-fired Ceramic Package for All Solid-State Hydrogen Sensor Modules |
I1-11 Li Mingyu, Harbin Institute of Technology (HIT), Shenzhen, China Focused Electromagnetic Induction Heating Technology and Its Application Exploration |
O1-06 Kwon Hyeong Ahn, ExleetEdge, Inc., Korea A Case Study of the EdgeAIcrack for the Health Monitoring of the Solder Joints of Electronic Packages Used in the System of the Railroad Industry |
O1-10 Thi Phuong Bui, Korea Institute of Industrial Technology (KITECH), Korea Size Effects of Mono-dispersed Hollow Silica Spheres on Transparency and Superhydrophobicity |
| 12:10-13:30 | Lunch | Special Session 11 (Closed Session) |
Special Session 12 (Closed Session) |
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| Session Chair | Kim Taek-Soo | Han Jinho | Shim Sang Eun | |||
| 13:30-14:00 | Plenary Talk 1 (Grand Ballroom) - Lee Kangwook, SK Hynix Inc., Korea HBM (High Bandwidth Memory) and Advanced Packaging Technology for AI Era |
"PIM 2.5D Large-Scale Super-Performance Interposer and 3D Hybrid Bonding Platform for PIM Seimconductor integrating Processors and High-Bandwidth Memories" Electronics and Telecommunications Research Institute (ETRI) |
"Development of Highly Thermally Conductive Non-conductive Film" Inha University |
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| 14:00-14:30 | Keynote Talk 1 (Grand Ballroom) - Kristina Kutukova, PVA Technology Hub GmbH, Germany Mechanical Robustness of Chiplets – An X-ray Microscopy Study (Online) |
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| 14:30-14:40 | Break Time | |||||
| Session Chair | Kim Tae-il | |||||
| 14:40-15:10 | Keynote Talk 2 (Grand Ballroom) - Park Seungbae, State University of New York at Binghamton, USA Reliability Challenges for Heterogeneously Integrated Packages |
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| 15:10-15:40 | Keynote Talk 3 (Grand Ballroom) - Katsuaki Suganuma, Osaka University, Japan Interconnection Technology for Advanced and Power Semiconductors |
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| 15:40-15:50 | Break Time | |||||
| Topic | Novel Packaging Technologies | Advanced Packaging II | Thermal Management I | Materials for Interconnects and Packaging II | Special Session 1 (Closed Session) |
Special Session 2 (Closed Session) |
| Session Chair | Kim Jong-Woong | Joo Jiho | Nam Youngsuk | Kim Hyun-Sik | Kwon Daeil | Lee Hakjun |
| 15:50-16:15 | I1-15 Georg Berger, EV Group, Austria Maskless Exposure Lithography Enables Novel Semiconductor Development in Advanced Packaging |
I1-18 Lee Jeong Won, Nepes Corporation, Korea Chip-let Heterogeneous Integration Packaging Based on Fan-out RDL Interposer Technology |
I1-21 Kang Joon Sang, Korea Advanced Institute of Science and Technology (KAIST), Korea High Thermal Conductivity Material for Thermal Management in Electronics Packaging |
I1-24 Kim Hyun-Sik, University of Seoul, Korea Effect of Y2O3-RE2O3(RE= Nd, Sm, Tb, Dy, Tm)-MgO Additives on Mechanical and Thermal Properties of Silicon Carbide Ceramics |
"Reliability and Thermal Management for Advanced Packages I" Sungkyunkwan University |
"Micro Semiconductor Socket for Highly Integrated Semiconductor Inspection" Korea Institute of Industrial Technology (KITECH) |
| 16:15-16:40 | I1-16 Jeon Eunsuk, Laserapps Co., Ltd., Korea Novel Singulation of Glass Substrate for Next Generation Advanced Semiconductor Packaging |
I1-19 Yeon Hanwool, Gwangju Institute of Science and Technology (GIST), Korea Monomolecular Coating on Copper for Reliable Organic Interposers under Mechanical, Thermal, and Electrical Stress |
I1-22 Cho Jungwan, Sungkyunkwan University, Korea Thermal Property Measurements using Thermoreflectance Techniques for Device and Packaging Applications |
I1-25 Iwanaga Hiroki, Toshiba Corporation (Visiting Professor of Rikkyo University), Japan Novel Eu(III) Complexes with an Asymmetric Diphosphine Dioxide Ligand and their Potential uses in Micro-LED Displays as Red Phosphors |
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| 16:40-17:05 | O1-11 Sung-Bin Kim, AnyCasting Co., Ltd., Korea Electroplating Technology for the Cu-Filling of Via Holes in 4-inch Wafer-Sized Glass Substrate |
I1-20 Hwang Kyojin, Samsung Electronics Co., Ltd., Korea New Embedding Capacitor Solutions for Extremely Large FC-BGA Package Platform |
I1-23 Jang Hyejin, Seoul National University, Korea Thermal Transport Properties of Electronics Packaging at the Nanoscale |
I1-26 Park Hyun, Dong-A University, Korea Microstructure and Elongation of Cu Foil Fabricated through Electrodeposition for Batteries |
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| 17:05-17:30 | I1-17 Kim Younghyun, Hanyang University, Korea Next-Gen Innovations: Co-Packaged Optics and Silicon Photonics |
O1-12 Kirihata Tomoka, Lintec Corporation, Japan A novel Transfer Bonding Process with Particle Less Tapes for Die to Wafer Integration |
Sponsor Night Setting | I1-27 Sangyup Kim, Sogang University, Korea Composite Materials for Managing Thermal Behavior in Semiconductor Testing and Packaging |
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| 17:30-18:00 | Break Time | |||||
| 18:00-20:00 | Sponsor Night and Lucky Draw (Sicily) | |||||
| Nov 7th, 2024 (Thu.) | ||||||
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| Room | Grand Ballroom A+B (400) | Capri (120) | Sicily (100) | Sydney (70) | Venice (32) | Miami (32) |
| Topic | Next-generation Electronic Devices | Packaging Design and Modeling | Flexible, Wearable, and Printed Electronics I | Materials for Interconnects and Packaging III | Special Session 3 (Closed Session) |
Special Session 4 (Closed Session) |
| Session Chair | Suh Minsuk | Shin Hyunseong | Kim Tae-il | Kim Min-Su | Kwon Daeil | Lee Hakjun |
| 9:00-9:30 | "Reliability and Thermal Management for Advanced Packages II" Sungkyunkwan University |
"Die Socket for Stacked Semiconductors and Test Handler Development" Korea Institute of Industrial Technology (KITECH) |
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| 9:30-9:55 | I2-01 Rettenmeier Roland, Evatec AG, Switzerland TGV for HPC |
I2-04 Myeong-Woo Kim, Synopsys, Inc., USA Multiscale Thermal, Mechanical and Performance Analysis for 3DIC with HBM |
I2-06 Kim Hyeok, University of Seoul, Korea Organic Packaging for Encapsulated Power-free Flexible Devices |
I2-09 Noh Sangkyun, Simmtech Co., Ltd., Korea Prepreg-based FCBGA for Advanced Packaging Substrate |
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| 9:55-10:20 | I2-02 Kuramochi Satoru, Dai Nippon Printing (DNP) Co., Ltd., Japan RDL on Glass for High Performance Computing Application |
I2-05 Kim Rock, Siemens EDA, Korea Innovator3D IC - Siemens EDA’s Comprehensive Multiphysics Cockpit for 3D IC Design |
I2-07 Jung Yei Hwan, Hanyang University, Korea Curvilinear Electronics based on Shape Deformable Stamp |
I2-10 Hiroaki Tatsumi, Osaka University, Japan Cu Ribbon Soldering on Power Module Substrate using Blue Diode Laser |
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| 10:20-10:45 | I2-03 Lim Jae-Hong, Gachon University, Korea Optimization of Additive and Current Conditions for Void-Free Filled Through-Glass/AAO Via |
O2-01 Hsu Shang-Feng, National Cheng-Kung University, Taiwan Development of an Innovative Process Emulator for Nonlinear-Bifurcated Warpage Prediction in FOWLP with Material Equivalence Approach |
I2-08 Xinge Xu, City University of Hong Kong, Hong Kong Engineering of Packing Materials for Permeable Wearable Electronics |
O2-02 Lee Byunghoon, Samsung Electronics Co., Ltd., Korea Development of Non Conductive Film (NCF) for Fine Pitch Connector-less Bonding with Low Temperature Solder |
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| 10:45-10:55 | Break Time | |||||
| Session Chair | Sohn Yoonchul | Special Session 13 (Closed Session) |
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| 10:55-11:10 | Opening Remark - Sayoon Kang / KMEPS (Grand Ballroom) | |||||
| 11:10-11:40 | Plenary Talk 2 (Grand Ballroom) - Ehrenfried Zschech, Brandenburg University of Technology, Germany Combining Acoustic Microscopy and X-Ray Microscopy for Metrology, Inspection and Failure Analysis in Advanced Packaging |
"Core Technologies Development of Polymer Interposer Materials and Processes for 2.xD Advanced Packages" Workshop LG Innotek |
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| 11:40-12:10 | Keynote Talk 4 (Grand Ballroom) - Kim Jichul, Samsung Electronics Co., Ltd., Korea Embracing Advanced Packaging for Future AI-Enabled Consumer Electronics |
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| 12:10-13:10 | Lunch | ICEP-IAAC Meeting (Closed Meeting) |
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| Session Chair | Ko Yong-Ho, Yoon Sang Won | |||||
| 13:10-14:00 | Poster Presentation (Grand Ballroom) | |||||
| Session Chair | Kwon Daeil | |||||
| 14:00-14:30 | Keynote Talk 5 (Grand Ballroom) - Lim Choon Khoon, ASMPT, Singapore Enabling the AI Era |
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| 14:30-15:00 | Keynote Talk 6 (Grand Ballroom) - Joo Young-Chang, Seoul National University, Korea Reliability Challenges in Advanced Interconnect and Packaging |
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| 15:00-15:20 | Break Time | |||||
| Topic | Advanced Packaging III | Reliability of Electronic Devices and Systems | Flexible, Wearable, and Printed Electronics II | ICEP Session | Materials for Interconnects and Packaging IV | Thermal Management II |
| Session Chair | Nam Seunghoon | Lee Tae-Ik | Jung Yei Hwan | Yasuhiro Morikawa | Kim Young-Cheon | Cho Jungwan |
| 15:20-15:45 | I2-11 Moreau Stephane, CEA, France How did the “Hybrid Bonding” Technology become Reliable? |
I2-14 Kang Tae Yeob, The University of Suwon, Korea Non-destructive Assessment of Corrosion in Electronic Packages by Processing S-parameters |
I2-16 Kim Tae-Il, Sungkyunkwan University, Korea Package for Advanced Bioelectronics |
I2-21 Hanna Taku, ULVAC Inc., Japan Polymer Fine via Formation based upon Plasma Etching Technology for 3D Chiplet Integration |
I2-25 Zhang Zheng, Osaka University, Japan Application of Ag Cap for Fine-pitch Cu Pillar Interconnection |
I2-26 Moon Seok Hwan, Electronics and Telecommunications Research Institute (ETRI), Korea Overcoming the Limitations of Heat Dissipation Technology due to High Integration and Thickness Reduction in Packaging |
| 15:45-16:10 | I2-12 Park Kyung-Ho, Korea Advanced Nano Fab Center (KANC), Korea The Study of the Chemical Mechanical Polishing (CMP) Parameters for Enhanced 3D Cu Hybrid Bonding |
I2-15 Kteyan Armen, Siemens EDA, Armenia Full-chip CPI Assessment for IC Performance and Reliability with Accurate Account of Thermal Effects |
I2-17 Song Young Min, Gwangju Institute of Science and Technology (GIST), Korea Bioinspired Advanced Camera Modules for Application-specific Vision Systems |
I2-22 Miyoshi Takayuki, Toray Engineering Co., Ltd., Japan Demonstration of Flux-less Bonding with Simplified Equipment Configuration |
O2-07 Bae Byeong-Soo, Korea Advanced Institute of Science and Technology (KAIST), Korea Low Dk/Df Siloxane Hybrid Material for Advanced Packaging Substrate |
I2-27 Nam Youngsuk, Korea Advanced Institute of Science and Technology (KAIST), Korea High-Efficiency Liquid Cooling for Semiconductor Devices |
| 16:10-16:35 | O2-03 Lim Jae-Sung, Hana Micron, Korea Development and Structural Analysis of 2.xD Advanced Package with a Bridge Die-based Platform |
O2-04 Jeong Hakyung, Korea Institute of Machinery and Materials (KIMM), Korea Evaluation of Adhesive Energy in Symmetric and Asymmetric Substrate Bonding for Temporary Bonding and Debonding |
I2-18 Kim Sunkook, Sungkyunkwan University, Korea Human Interactive Sensors and Devices |
I2-23 Fukushima Takafumi, Tohoku University, Japan 3D-IC and Hybrid Bonding Activity in Tohoku CHIPS |
O2-08 Kwon Yongwoo, Hongik University, Korea Phase-field Modeling of Polycrystalline Microstructure Formation in Thin Films for Nanoelectronics |
I2-28 Kim Tae Young, Seoul National University of Science and Technology, Korea Cooling Technologies for Microelectronics: A Focus on Nvidia GPU Tensor Core Cooling Solutions |
| 16:35-17:00 | I2-13 Sanchez Debbie Claire, ERS electronic GmbH, Germany Yield Improvement in Advanced Packaging through New Photonic Wafer Debonding Technology |
O2-05 Han Seungwoo, Korea Institute of Machinery and Materials (KIMM), Korea Thermal Fatigue Testing on Bonding Parts of Thermoelectric Devices using Peltier Effect |
I2-19 Lee Myungho (Mike), TechL Co., Ltd., Korea Flexible PCB for mmWave Antenna Application |
I2-24 Kuramochi Satoru, Dai Nippon Printing Co., Ltd., Japan Large Scale Glass substrate for High Performance Computing Application |
O2-09 Choi Gwang-Mun, Electronics and Telecommunications Research Institute (ETRI), Korea Low-Carbon Epoxy-Siloxane Flux Technology for Fine-Pitch Solder Bump Interconnection |
I2-29 Lee Hyoungsoon, Chung-Ang University, Korea Embedded Liquid Cooling for High Performance Electronic Devices |
| 17:00-17:25 | Banquet Setting | O2-06 Hladik Lukas, Tescan Group, A.S., Czech Streamlining Millimeter-Scale Semiconductor Failure Analysis: An Integrated Workflow with Plasma FIB-SEM, Laser Techniques, and Advanced FA Tools |
I2-20 Kim Munho, Nanyang Technological University, Singapore Wafer Bonding and Single Crystal Nanomembrane for Flexible Electronics |
General Meeting (Sydney) | O2-10 Joo Seung Hwan, Inha University, Korea Design and Performance Test of Newly Developed 10um Aerosol 3D Printing Nozzle Systems for EMI Shielding and Semiconductor Interconnect |
I2-30 Chae-Yoon Kim, AnyCasting Co., Ltd., Korea Development of Electrochemical 3D Printing Technology for the Fabrication of Micro Bumps and Cooling Structures |
| 17:25-18:00 | Break Time | |||||
| 18:00-20:00 | Banquet and Haedong Award Ceremony (Grand Ballroom) | |||||
| Nov 8th, 2024 (Fri.) | |||||||
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| Room | Grand Ballroom A (200) | Grand Ballroom B (100) | Capri (120) | Sicily (100) | Sydney (70) | Venice (32) | Miami (32) |
| Topic | Young Scientist II | Young Scientist III | Young Scientist IV | |
Special Session 5 - Process, Material, Reliability and Simulation for RDL Packaging Technology | Special Session 6 (Closed Session) |
Special Session 7 (Closed Session) |
| Session Chair | Oh Seung Jin | Kang Tae Yeob | Park Ah-Young | Choi Changhwan | Jung Yei Hwan | Sohn Yoonchul | |
| 9:00-9:15 | O3-01 Jeong Inhye, Gwangju Institute of Science and Technology (GIST), Korea Effective Heat Dissipation in Three-Dimensional Integration with Crystalline Inter-bonding Dielectrics |
O3-06 Choi Donggyu, Korea Institute of Industrial Technology (KITECH), Korea Enhancing Ultrafine Printability of Water-soluble Flux with Type 7 Solder Paste for Flip Chip Interconnects |
O3-11 Youn Hayoung, Korea Institute of Machinery and Materials (KIMM), Korea Femtosecond Laser-Assisted SiC Wafer Thinning Process |
S05-01 Kwan Kyu Park, Hanyang University, Korea Measurement of Electric Properties of PID (Photo-imageable dielectric) Film-based Test Structure |
"Conductive Adhesive Materials for 3D Packaging" Hanyang University Sungkyunkwan University STECO |
"Training of Semiconductor Advanced Packaging Specialists" Chosun University Chonnam National University Gwangju Institute of Science and Technology Inha University |
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| 9:15-9:30 | O3-02 Kim Injoo, Seoul National University of Science and Technology, Korea The Strength of Dielectric Bond in Hybrid Bonding using Different Plasma Treatment Gases |
O3-07 Jeong Daeyoon, Andong National University, Korea Effects of Annealing Conditions on the Interfacial Characteristics of ALD Ru/ZnO Thin Films for Advanced Interconnects |
O3-12 Lee Yurim, Yonsei University, Korea Hydrogel-based Adhesive Film for Soft Electronics Packaging |
S05-02 Changhwan Choi, Hanyang University, Korea Improved Adhesion between PSPI and Metal Layer for RDL Process |
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| 9:30-9:45 | O3-03 Kwon Yongbeom, Andong National University, Korea Post-bond Annealing Effect on the Quantitative Interfacial Adhesion Energy of Cu/Cu Interface for Low-temperature Hybrid Bonding |
O3-08 Lee Min Geun, Korea Advanced Institute of Science and Technology (KAIST), Korea Thermal Conductivity Enhancement of Underfill Material with Inducing Double Percolation Effect from Core-shell Structure |
O3-13 Yoo Woong-Kyoo, Hanyang University, Korea Automatic Pattern Classification-based Prediction of Warpage in Complex Patterned Semiconductor Packages Considering The Anisotropic Viscoelastic Properties |
S05-03 Hongyun So, Hanyang University, Korea Analysis of Electrodeposition Process for Cu Microstructure |
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| 9:45-10:00 | O3-04 Ju Min Sang, Korea Advanced Institute of Science and Technology (KAIST), Korea Warpage and Delamination Behavior on Sub-100µm Thickness Epoxy Molding Compound : An Investigation for Molded Underfill in Advanced 3D Packaging |
O3-09 Yu Hayoung, Korea Institute of Industrial Technology (KITECH), Korea Microscale-tensile and Work Hardening Behaviors of Each Weld Part of Solid-state Cu to Cu Direct Bonding using Refill Friction Stir Spot Joining |
O3-14 Ham Yeong Seok, Korea Advanced Institute of Science and Technology (KAIST), Korea Mechanical Reliability of SiCN - SiOC:H in BEOL Interconnects According to Fracture Mode |
S05-04 Dong Rip Kim, Hanyang University, Korea Transient Thermal Analysis of Multi-layer RDL for 2.1D Package |
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| 10:00-10:15 | O3-05 Lee Gaeun, Electronics and Telecommunications Research Institute (ETRI), Korea Enhancing Reliability of 30μm-Pitch Micro-Bumps Using Room Temperature Laser-Assisted Bonding (LAB) with Laser Non-Conductive Paste (NCP) |
O3-10 Shin Joohwan, Sungkyunkwan University, Korea Polymeric Conductive Adhesive-Based Ultrathin Epidermal Electrodes for Long-Term Monitoring of Electrophysiological Signals |
O3-15 Kim Beomgi, Andong National University, Korea In-situ Study on the Stress-temperature Characteristics of Cu/PI Thin Films for Heterogeneous Integration Packaging with Si-bridge |
S05-05 Jaemyung Lim, Hanyang University, Korea The Study on Crosstalk for the Silicon Interposer |
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| 10:15-10:30 | Break Time | S05-06 Hak-Sung Kim, Hanyang University, Korea Experimental and Simulation Study for Accurate Warpage Prediction of Semiconductor Package |
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| Topic | Young Scientist V | Young Scientist VI | Young Scientist VII | |
Special Session 8 (Closed Session) |
Special Session 9 (Closed Session) |
Special Session 10: SimCrunch's Day (Closed Session) |
| Session Chair | Choe Seunghoe | Lee Yong-Seok | Kwon Jimin | Yoo Sehoon | Kim Taek-Soo | Kim Sung Yong | |
| 10:30-10:45 | O3-16 Kim Uhyeon, Pohang University of Science and Technology (POSTECH), Korea In-Situ Bonding of Ultra-Thin-Silicon Interposer via Transfer Printing for High Density Heterogeneous Integration |
O3-21 Kim Young Gil, Sungkyunkwan University, Korea Thermally Managed, Injectable Optoelectronic Probe with Heat Dissipation Guide for Photodynamic Therapy |
O3-26 Cho Donghyeon, Korea Advanced Institute of Science and Technology (KAIST), Korea Fabrication of an Ultra-Thin Fiber-Type Sensor for Deformation Measurement During Underfill Curing Process |
"Surface Finish Technology for Ultrafine Pitch Package Interconnect" Korea Institute of Industrial Technology (KITECH) |
"High-reliability Silicon Bridge Heterogeneous Packaging Technology for High-efficiency Power Distribution" Korea Advanced Institute of Science and Technology (KAIST) |
"Engineering Simulation-based Solution for Small and Medium-sized Business Difficulties" Tech University of Korea |
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| 10:45-11:00 | O3-17 Kim Taekhyeon, Hanyang University, Korea Reliability Improvement of RDL Interposer in Semiconductor Packages through Optimization of Electroplating Current Density |
O3-22 Cho Hyunho, Korea Advanced Institute of Science and Technology (KAIST), Korea Jet Nozzle Array Optimization for Enhancing Temperature Uniformity in Direct Liquid Cooling of Semiconductor Packages with Non-uniform Heat Fluxes |
O3-27 Ye Yeong-Sinn, Sungkyunkwan University, Korea Choline-based Ionic Liquids and Gels for Long Term Organic Electrochemical Transistors |
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| 11:00-11:15 | O3-18 Choi Hyesu, Sungkyunkwan University, Korea Highly Stretchable and Strain-Insensitive Liquid-Metal based Elastic Kirigami Electrodes (LM-eKE) |
O3-23 Kim Minjin, Andong National University, Korea ALD ZnO barrier Effects on the Interfacial Adhesion Energy for Advanced ALD Ru Interconnects |
O3-28 Jo Eunjin, Korea Institute of Industrial Technology (KITECH), Korea Oxidation-free Bonding of Ag Nanoporous Sheets onto Bare Cu Substrates for Improved EMC Molding Qualities |
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| 11:15-11:30 | O3-19 Sim Gyumin, Korea Advanced Institute of Science and Technology (KAIST), Korea Investigating Infiltration Time and Void Formation in Nanofiller-Based Underfill Materials for Semiconductor Applications |
O3-24 Kim Heui-Su, Hanyang University, Korea Laser Spallation Test for Measurement of the Interfacial Adhesion of LPCVD and PECVD Silicon Nitride/Copper Films |
O3-29 Kim Yehri, Korea Institute of Industrial Technology (KITECH), Korea Mechanical Performance of Oxygen-free Cu Sintering in the Air on Cold-rolled Cu Substrates |
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| 11:30-11:45 | O3-20 Lee Se Min, Hanyang University, Korea Enhancing Adhesion of Ti/Cu Seed Layers on ABF Substrate through Plasma Treatment and Seed Layer Thickness Variation |
O3-25 Kim Younghoon, Inha University, Korea Study on the Electromagnetic Shielding Properties of External Copper Trace Design by Layer for MLP (Multi-layer PCB) |
O3-30 Kim Sang-Il, Hanyang University, Korea In-situ Non-destructive Inspection Technique for Analyzing Chip Alignment and Warpage in Semiconductor Packages using Terahertz Waves |
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| 11:45-12:00 | Break Time | ||||||
| 12:00-12:20 | ISMP Award Ceremony, Lucky Draw and Closing Remark (Grand Ballroom A) | ||||||