ISMP 2024

Invited Speakers

• Xiaopeng Xu

  Synopsis, Inc., USAMultiscale thermal, mechanical and performance analysis for 3DIC with HBM

• Armen Kteyan

  Siemens EDA, ArmeniaFull-chip CPI assessment for IC performance and reliability with accurate account of thermal effects

• Stephane Moreau

  CEA, FranceHow did the “hybrid bonding” technology become reliable?

• Olivier Thomas

  IM2NP, FranceSynchrotron X-ray light for understanding Ge-rich Ge-Sb-Te materials used as embedded phase change memories in automotive applications (Online)

• Kyojin Hwang

  Samsung Electronics Co., Ltd., KoreaNew embedding capacitor solutions for extremely large FC-BGA package platform

• Dongwoo Han

  SK hynix Inc., KoreaMaterial Development Trends for Advanced Package

• Bioh Kim, CEO

  Yield Engineering Systems, Inc., KoreaInnovations in Various Process Technologies for Advanced Packaging

• Eunsuk Jeon, CEO

  Laserapps, KoreaNovel singulation of glass substrate for Next generation Advanced semiconductor packaging

• Joonho You, CEO

  nexensor Inc., KoreaThe Study of Optical Measurement Technologies for Advanced Packaging and HBM Process

• Yoonjin Kim, CEO

  Teraon Co., Ltd., KoreaAdvanced Non-pressure Die Attach Paste of High Thermal Conductivity and Low Modulus for Power Semiconductor Packages

• Myungho (Mike) Lee, COO

  TechL Co., Ltd., KoreaFlexible PCB for mmWave Antenna Application

• Mujin Kim, CTO

  DeepSeers, KoreaSemiconductor Package Inspection: A Comparative Analysis of Machine Vision Techniques for Defect Detection

• Jeong Won Lee

  Nepes, KoreaChip-let Heterogeneous Integration packaging based on Fan-out RDL interposer technology

• Roland Rettenmeier, Senior Manager

  Evatec AG, SwitzerlandTGV for HPC

• Kuramochi Satoru

  Dai Nippon Printing (DNP) Co., Ltd., Japan RDL on Glass for High Performance Computing Application

• Hiroki Iwanaga

  Toshiba Corporation, JapanNovel Eu(III) complexes with an asymmetric diphosphine dioxide ligand and their potential uses in micro-LED displays as red phosphors

• Kyung-Ho Park

  Korea Advanced Nano Fab Center, KoreaThe Study of the Chemical Mechanical Polishing (CMP) Parameters for Enhanced 3D Cu Hybrid Bonding

• Seok Hwan Moon

  Electronics and Telecommunications Research Institute, KoreaOvercoming the limitations of heat dissipation technology due to high integration and thickness reduction in packaging

• Hyunkyu Moon

  Korea Institute of Machinery and Materials, Korea3D Integration of Thin Die on Curved Surfaces for Optical Applications

• RYU ILL

  Seoul National University, KoreaDefect-Driven Plasticity in Microelectronics under thermal cycles

• Hyejin Jang

  Seoul National University, KoreaThermal Transport Properties of Electronics Packaging at the Nanoscale

• Sang Won Yoon

  Seoul National University, KoreaConsiderations for Packaging Solutions for Current Automotive Power Modules

• Tae-il Kim

  Sungkyunkwan University, KoreaPackage for Advanced Bioelectronics

• Jungwan Cho

  Sungkyunkwan University, KoreaThermal property measurements using thermoreflectance techniques for device and packaging applications

• Sunkook Kim

  Sungkyunkwan University, KoreaFlexible Electronics and Sensors

• Youngsuk Nam

  Korea Advanced Institute of Science and Technology (KAIST), KoreaEnergy efficient thermal management for AI semiconductors

• Hyun Park

  Dong-A University, KoreaMicrostructure and Elongation of Cu foil fabricated through electrodeposition for Batteries

• Young Min Song

  Gwangju Institute of Science and Technology (GIST), KoreaBioinspired advanced camera modules for application-specific vision systems

• Seok Kim

  Pohang University of Science and Technology (POSTECH), KoreaTransfer Printing for Micro-LED Assembly & Advanced Packaging

• Tae Yeob Kang

  The University of Suwon, KoreaNon-destructive Assessment of Corrosion in Electronic Packages by Processing S-parameters

• Tae Young Kim

  Seoul National University of Science and Technology, KoreaCooling technologies for microelectronics: A focus on Nvidia GPU tensor core cooling solutions

• Hyun-Sik Kim

  University of Seoul, KoreaEffect of Y2O3-RE2O3(RE= Nd, Sm, Tb, Dy, Tm)-MgO additives on mechanical and thermal properties of silicon carbide ceramics

• Hyeok Kim

  University of Seoul, KoreaOrganic Packaging for Encapsulated Power-free Flexible Devices

• Tatsumi Hiroaki

  Osaka University, JapanCu Ribbon Soldering on Power Module Substrate using Blue Diode Laser

• Chuantong Chen

  Osaka University, JapanDevelopment of low temperature Ag-Si composite paste sintering material for high-reliability SiC power modules

• Zheng Zhang

  Osaka University, JapanApplication of Ag cap for fine-pitch Cu pillar interconnection

• Munho Kim

  Nanyang Technological University, SingaporeWafer bonding and single crystal nanomembrane for flexible electronics

• Xinge Yu

  City University of Hong Kong, Hong KongEngineering of packing materials for permeable wearable electronics

• Joon Sang Kang

  Korea Advanced Institute of Science and Technology (KAIST), KoreaHigh thermal conductivity material for thermal management in electronics packaging

• Rock Kim

  Siemens EDA, KoreaInnovator3D IC - Siemens EDA's Comprehensive Multiphysics Cockpit for 3D IC design

• Debbie Claire Sanchez

  ERS electronic GmbH, GermanyYield Improvement in Advanced Packaging through New Photonic Wafer Debonding Technology

• Takafumi Fukushima

  Tohoku University, Japan3D-IC and Hybrid Bonding Activity in Tohoku CHIPS

• Takayuki Miyoshi

  Toray Engineering Co., Ltd., JapanDemonstration of Flux-less Bonding with Simplified Equipment Configuration

• Taku Hanna

  Ulvac Inc., JapanPolymer Fine via Formation based upon Plasma Etching Technology for 3D Chiplet Integration

• Satoru Kuramochi

  Dai Nippon Printing Co., Ltd., JapanLarge Scale Glass substrate for High Performance Computing Application

• Sumin Kang

  Seoul National University of Science and Technology, KoreaAdvanced transfer technologies of ultrathin films for flexible electronics

• Younghyun Kim

  Hanyang University, KoreaNext-Gen Innovations: Co-Packaged Optics and Silicon Photonics

• Sung-Gyu Kang

  Gyeongsang National University, KoreaStrain Rate and Temperature-Dependent Micromechanical Properties of Copper Micropillars Fabricated by Localized Electrodeposition

• Hyoungsoon Lee

  Chung-Ang University, KoreaEmbedded Liquid Cooling for High Performance Electronic Devices

• Yei Hwan Jung

  Hanyang University, KoreaCurvilinear Electronics based on Shape Deformable Stamp

• Sangkyun Noh

  Simmtech Co., Ltd., KoreaPrepreg-based FCBGA for Advanced Packaging Substrate

• Hanwool Yeon

  Gwangju Institute of Science and Technology, KoreaMonomolecular Coating on Copper for Reliable Organic Interposers under Mechanical, Thermal, and Electrical Stress

• Jae-Hong Lim

  Gachon University, KoreaOptimization of Additive and Current Conditions for Void-Free Filled Through-Glass/AAO Via

• Sangyup Kim

  Sogang University, KoreaComposite Materials for Managing Thermal Behavior in Semiconductor Testing and Packaging

• Mingyu Li

  Harbin Institute of Technology (HIT), ChinaFocused Electromagnetic Induction Heating Technology and Its Application Exploration

• Georg Berger

  EV Group, AustriaMaskless Exposure Lithography Enables Novel Semiconductor Development in Advanced Packaging

• Sung-Bin Kim

  AnyCasting Co., Ltd., KoreaDevelopment of Electrochemical 3D Printing Technology for the Fabrication of Micro Bumps and Cooling Structures