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Plenary Speakers
Keynote Speakers
Invited Speakers

  • Xiaopeng Xu

    Synopsis, Inc., USAMultiscale thermal, mechanical and performance analysis for 3DIC with HBM

  • Armen Kteyan

    Siemens EDA, ArmeniaFull-chip CPI assessment for IC performance and reliability with accurate account of thermal effects

  • Stephane Moreau

    CEA, FranceHow did the “hybrid bonding” technology become reliable?

  • Olivier Thomas

    IM2NP, FranceSynchrotron X-ray light for understanding Ge-rich Ge-Sb-Te materials used as embedded phase change memories in automotive applications (Online)

  • Kyojin Hwang

    Samsung Electronics Co., Ltd., KoreaNew embedding capacitor solutions for extremely large FC-BGA package platform

  • Dongwoo Han

    SK hynix Inc., KoreaMaterial Development Trends for Advanced Package

  • Bioh Kim, CEO

    Yield Engineering Systems, Inc., KoreaInnovations in Various Process Technologies for Advanced Packaging

  • Eunsuk Jeon, CEO

    Laserapps, KoreaNovel singulation of glass substrate for Next generation Advanced semiconductor packaging

  • Joonho You, CEO

    nexensor Inc., KoreaThe Study of Optical Measurement Technologies for Advanced Packaging and HBM Process

  • Yoonjin Kim, CEO

    Teraon Co., Ltd., KoreaAdvanced Non-pressure Die Attach Paste of High Thermal Conductivity and Low Modulus for Power Semiconductor Packages

  • Myungho (Mike) Lee, COO

    TechL Co., Ltd., KoreaFlexible PCB for mmWave Antenna Application

  • Mujin Kim, CTO

    DeepSeers, KoreaSemiconductor Package Inspection: A Comparative Analysis of Machine Vision Techniques for Defect Detection

  • Jeong Won Lee

    Nepes, KoreaChip-let Heterogeneous Integration packaging based on Fan-out RDL interposer technology

  • Roland Rettenmeier, Senior Manager

    Evatec AG, SwitzerlandTGV for HPC

  • Kuramochi Satoru

    Dai Nippon Printing (DNP) Co., Ltd., Japan RDL on Glass for High Performance Computing Application

  • Hiroki Iwanaga

    Toshiba Corporation, JapanNovel Eu(III) complexes with an asymmetric diphosphine dioxide ligand and their potential uses in micro-LED displays as red phosphors

  • Kyung-Ho Park

    Korea Advanced Nano Fab Center, KoreaThe Study of the Chemical Mechanical Polishing (CMP) Parameters for Enhanced 3D Cu Hybrid Bonding

  • Seok Hwan Moon

    Electronics and Telecommunications Research Institute, KoreaOvercoming the limitations of heat dissipation technology due to high integration and thickness reduction in packaging

  • Hyunkyu Moon

    Korea Institute of Machinery and Materials, Korea3D Integration of Thin Die on Curved Surfaces for Optical Applications

  • RYU ILL

    Seoul National University, KoreaDefect-Driven Plasticity in Microelectronics under thermal cycles

  • Hyejin Jang

    Seoul National University, KoreaThermal Transport Properties of Electronics Packaging at the Nanoscale

  • Sang Won Yoon

    Seoul National University, KoreaConsiderations for Packaging Solutions for Current Automotive Power Modules

  • Tae-il Kim

    Sungkyunkwan University, KoreaPackage for Advanced Bioelectronics

  • Jungwan Cho

    Sungkyunkwan University, KoreaThermal property measurements using thermoreflectance techniques for device and packaging applications

  • Sunkook Kim

    Sungkyunkwan University, KoreaFlexible Electronics and Sensors

  • Youngsuk Nam

    Korea Advanced Institute of Science and Technology (KAIST), KoreaEnergy efficient thermal management for AI semiconductors

  • Hyun Park

    Dong-A University, KoreaMicrostructure and Elongation of Cu foil fabricated through electrodeposition for Batteries

  • Young Min Song

    Gwangju Institute of Science and Technology (GIST), KoreaBioinspired advanced camera modules for application-specific vision systems

  • Seok Kim

    Pohang University of Science and Technology (POSTECH), KoreaTransfer Printing for Micro-LED Assembly & Advanced Packaging

  • Tae Yeob Kang

    The University of Suwon, KoreaNon-destructive Assessment of Corrosion in Electronic Packages by Processing S-parameters

  • Tae Young Kim

    Seoul National University of Science and Technology, KoreaCooling technologies for microelectronics: A focus on Nvidia GPU tensor core cooling solutions

  • Hyun-Sik Kim

    University of Seoul, KoreaEffect of Y2O3-RE2O3(RE= Nd, Sm, Tb, Dy, Tm)-MgO additives on mechanical and thermal properties of silicon carbide ceramics

  • Hyeok Kim

    University of Seoul, KoreaOrganic Packaging for Encapsulated Power-free Flexible Devices

  • Tatsumi Hiroaki

    Osaka University, JapanCu Ribbon Soldering on Power Module Substrate using Blue Diode Laser

  • Chuantong Chen

    Osaka University, JapanDevelopment of low temperature Ag-Si composite paste sintering material for high-reliability SiC power modules

  • Zheng Zhang

    Osaka University, JapanApplication of Ag cap for fine-pitch Cu pillar interconnection

  • Munho Kim

    Nanyang Technological University, SingaporeWafer bonding and single crystal nanomembrane for flexible electronics

  • Xinge Yu

    City University of Hong Kong, Hong KongEngineering of packing materials for permeable wearable electronics

  • Joon Sang Kang

    Korea Advanced Institute of Science and Technology (KAIST), KoreaHigh thermal conductivity material for thermal management in electronics packaging

  • Rock Kim

    Siemens EDA, KoreaInnovator3D IC - Siemens EDA's Comprehensive Multiphysics Cockpit for 3D IC design

  • Debbie Claire Sanchez

    ERS electronic GmbH, GermanyYield Improvement in Advanced Packaging through New Photonic Wafer Debonding Technology

  • Takafumi Fukushima

    Tohoku University, Japan3D-IC and Hybrid Bonding Activity in Tohoku CHIPS

  • Takayuki Miyoshi

    Toray Engineering Co., Ltd., JapanDemonstration of Flux-less Bonding with Simplified Equipment Configuration

  • Taku Hanna

    Ulvac Inc., JapanPolymer Fine via Formation based upon Plasma Etching Technology for 3D Chiplet Integration

  • Satoru Kuramochi

    Dai Nippon Printing Co., Ltd., JapanLarge Scale Glass substrate for High Performance Computing Application

  • Sumin Kang

    Seoul National University of Science and Technology, KoreaAdvanced transfer technologies of ultrathin films for flexible electronics

  • Younghyun Kim

    Hanyang University, KoreaNext-Gen Innovations: Co-Packaged Optics and Silicon Photonics

  • Sung-Gyu Kang

    Gyeongsang National University, KoreaStrain Rate and Temperature-Dependent Micromechanical Properties of Copper Micropillars Fabricated by Localized Electrodeposition

  • Hyoungsoon Lee

    Chung-Ang University, KoreaEmbedded Liquid Cooling for High Performance Electronic Devices

  • Yei Hwan Jung

    Hanyang University, KoreaCurvilinear Electronics based on Shape Deformable Stamp

  • Sangkyun Noh

    Simmtech Co., Ltd., KoreaPrepreg-based FCBGA for Advanced Packaging Substrate

  • Hanwool Yeon

    Gwangju Institute of Science and Technology, KoreaMonomolecular Coating on Copper for Reliable Organic Interposers under Mechanical, Thermal, and Electrical Stress

  • Jae-Hong Lim

    Gachon University, KoreaOptimization of Additive and Current Conditions for Void-Free Filled Through-Glass/AAO Via

  • Sangyup Kim

    Sogang University, KoreaComposite Materials for Managing Thermal Behavior in Semiconductor Testing and Packaging

  • Mingyu Li

    Harbin Institute of Technology (HIT), ChinaFocused Electromagnetic Induction Heating Technology and Its Application Exploration

  • Georg Berger

    EV Group, AustriaMaskless Exposure Lithography Enables Novel Semiconductor Development in Advanced Packaging

  • Sung-Bin Kim

    AnyCasting Co., Ltd., KoreaDevelopment of Electrochemical 3D Printing Technology for the Fabrication of Micro Bumps and Cooling Structures